Semiconductor integrated circuit cards and communication systems including the same

ABSTRACT

A semiconductor integrated card includes an external package, a subscriber identification module (SIM) circuit, a plurality of SIM pins, a storage device and a plurality of memory pins. The SIM circuit is formed inside of the external package and is configured to store subscriber information. The SIM pins are formed on a surface of the external package and are electrically connected to the SIM circuit. The storage device is formed inside of the external package and is separated from the SIM circuit. The storage device includes a nonvolatile memory device. The memory pins are formed on the surface of the external package and are electrically connected to the storage device.

CROSS-REFERENCE TO RELATED APPLICATION

This U.S. application is a Continuation of U.S. patent application Ser.No. 15/793,469 filed on Oct. 25, 2017, now allowed, which claimspriority under 35 USC § 119 to Korean Patent Application No.10-2016-0182372, filed on Dec. 29, 2016, in the Korean IntellectualProperty Office, the disclosure of each of which is incorporated byreference in its entirety herein.

BACKGROUND 1. Technical Field

Exemplary embodiments relate to semiconductor integrated circuit (IC)cards, and more particularly to semiconductor IC cards capable ofperforming a function of a subscriber identification module (SIM) cardand a function of a storage device simultaneously and communicationsystems including the same.

2. Discussion of the Related Art

Recently, when a communication device such as a smart phone is toperform wireless communications, a SIM card is connected to thecommunication device.

SUMMARY

Some exemplary embodiments provide a semiconductor integrated circuit(IC) card capable of performing a function of a subscriberidentification module (SIM) card and a function of a storage devicesimultaneously.

Some exemplary embodiments provide a communication system including thesemiconductor IC card.

According to exemplary embodiments, a semiconductor IC card includes anexternal package, a SIM circuit, a plurality of SIM pins, a storagedevice and a plurality of memory pins. The SIM circuit is formed insideof the external package and is configured to store subscriberinformation. The SIM pins are formed on a surface of the externalpackage and are electrically connected to the SIM circuit. The storagedevice is formed inside of the external package and is separated fromthe SIM circuit. The storage device includes a nonvolatile memorydevice. The memory pins are formed on the surface of the externalpackage and are electrically connected to the storage device.

According to exemplary embodiments, a semiconductor IC card includes anexternal package, a SIM circuit, a plurality of SIM pins, a storagedevice and a plurality of memory pins. The external package has twopairs of edges, in which the edges of each pair are arranged opposite toeach other. The SIM circuit is formed inside of the external package,and is configured to store subscriber information. The SIM pins areformed on a surface of the external package and are electricallyconnected to the SIM circuit. The storage device is formed inside of theexternal package and is separated from the SIM circuit. The storagedevice includes a nonvolatile memory device. The memory pins are formedon the surface of the external package and are electrically connected tothe storage device.

According to exemplary embodiments, a communication device includes afirst external card slot and a second external card slot. Thesemiconductor IC card is mounted on the first external card slot, and isconfigured to perform a first function to store data provided from thecommunication device and a second function to perform a subscriberauthentication using a first subscriber information when thecommunication device performs a wireless communication via a firstwireless network. The semiconductor IC card includes an externalpackage, a SIM circuit, a plurality of SIM pins, a storage device and aplurality of memory pins. The SIM circuit is formed inside of theexternal package and is configured to store the subscriber information.The SIM pins are formed on a surface of the external package and areelectrically connected to the SIM circuit. The storage device is formedinside of the external package and is separated from the SIM circuit.The storage device includes a nonvolatile memory device. The memory pinsare formed on the surface of the external package and are electricallyconnected to the storage device.

Accordingly, the semiconductor IC card may perform a function of a SIMcard and a function of a storage device simultaneously. Therefore, acommunication system including the semiconductor IC card may connect toa SIM card semiconductor device and a storage device using fewerexternal card slots.

BRIEF DESCRIPTION OF THE DRAWINGS

Illustrative, non-limiting exemplary embodiments will be more clearlyunderstood from the following detailed description in conjunction withthe accompanying drawings.

FIG. 1 is a block diagram illustrating a semiconductor integratedcircuit (IC) card according to exemplary embodiments.

FIGS. 2 through 5 are diagrams illustrating examples of thesemiconductor IC card when the semiconductor IC card of FIG. 1 has ashape and size according to a first standard.

FIGS. 6 through 8 are diagrams illustrating examples of thesemiconductor IC card when the semiconductor IC card of FIG. 1 has ashape and size according to a second standard.

FIG. 9 is a block diagram illustrating a communication system accordingto exemplary embodiments.

FIG. 10 is a block diagram illustrating a communication system accordingto exemplary embodiments.

FIGS. 11 and 12 are diagrams for explaining that the communicationdevice in the communication system of FIGS. 9 and 10 detects whether asemiconductor IC card is mounted.

FIG. 13 is a flow chart illustrating an initial operation of thecommunication system of FIGS. 9 and 10.

DETAILED DESCRIPTION OF THE EMBODIMENTS

The present disclosure now will be described more fully hereinafter withreference to the accompanying drawings, in which various exemplaryembodiments are shown. The invention may, however, be embodied in manydifferent forms and should not be construed as limited to the exemplaryembodiments set forth herein. These example exemplary embodiments arejust that—examples—and many embodiments and variations are possible thatdo not require the details provided herein. It should also be emphasizedthat the disclosure provides details of alternative examples, but suchlisting of alternatives is not exhaustive. Furthermore, any consistencyof detail between various exemplary embodiments should not beinterpreted as requiring such detail—it is impracticable to list everypossible variation for every feature described herein. The language ofthe claims should be referenced in determining the requirements of theinvention.

Although the figures described herein may be referred to using languagesuch as “one embodiment,” or “certain embodiments,” these figures, andtheir corresponding descriptions are not intended to be mutuallyexclusive from other figures or descriptions, unless the context soindicates. Therefore, certain aspects from certain figures may be thesame as certain features in other figures, and/or certain figures may bedifferent representations or different portions of a particularexemplary embodiment.

The terminology used herein is for the purpose of describing particularexemplary embodiments only and is not intended to be limiting of theinvention. As used herein, the singular forms “a”, “an” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise. As used herein, the term “and/or” includes any andall combinations of one or more of the associated listed items and maybe abbreviated as “/”.

It will be understood that, although the terms first, second, third etc.may be used herein to describe various elements, components, regions,layers and/or sections, these elements, components, regions, layersand/or sections should not be limited by these terms. Unless the contextindicates otherwise, these terms are only used to distinguish oneelement, component, region, layer or section from another element,component, region, layer or section, for example as a naming convention.Thus, a first element, component, region, layer or section discussedbelow in one section of the specification could be termed a secondelement, component, region, layer or section in another section of thespecification or in the claims without departing from the teachings ofthe present invention. In addition, in certain cases, even if a term isnot described using “first,” “second,” etc., in the specification, itmay still be referred to as “first” or “second” in a claim in order todistinguish different claimed elements from each other.

It will be further understood that the terms “comprises” and/or“comprising,” or “includes” and/or “including” when used in thisspecification, specify the presence of stated features, regions,integers, steps, operations, elements, and/or components, but do notpreclude the presence or addition of one or more other features,regions, integers, steps, operations, elements, components, and/orgroups thereof.

It will be understood that when an element is referred to as being“connected” or “coupled” to or “on” another element, it can be directlyconnected or coupled to or on the other element or intervening elementsmay be present. In contrast, when an element is referred to as being“directly connected” or “directly coupled” to another element, or as“contacting” or “in contact with” another element, there are nointervening elements present. Other words used to describe therelationship between elements should be interpreted in a like fashion(e.g., “between” versus “directly between,” “adjacent” versus “directlyadjacent,” etc.).

As used herein, items described as being “electrically connected” areconfigured such that an electrical signal can be passed from one item tothe other. Therefore, a passive electrically conductive component (e.g.,a wire, pad, internal electrical line, etc.) physically connected to apassive electrically insulative component (e.g., a prepreg layer of aprinted circuit board, an electrically insulative adhesive connectingtwo devices, an electrically insulative underfill or mold layer, etc.)is not electrically connected to that component. Moreover, items thatare “directly electrically connected,” to each other are electricallyconnected through one or more passive elements, such as, for example,wires, pads, internal electrical lines, through vias, etc. As such,directly electrically connected components do not include componentselectrically connected through active elements, such as transistors ordiodes. Directly electrically connected elements may be directlyphysically connected and directly electrically connected.

As is traditional in the field of the disclosed technology, features andembodiments are described, and illustrated in the drawings, in terms offunctional blocks, units and/or modules. Those skilled in the art willappreciate that these blocks, units and/or modules are physicallyimplemented by electronic (or optical) circuits such as logic circuits,discrete components, microprocessors, hard-wired circuits, memoryelements, wiring connections, and the like, which may be formed usingsemiconductor-based fabrication techniques or other manufacturingtechnologies. In the case of the blocks, units and/or modules beingimplemented by microprocessors or similar, they may be programmed usingsoftware (e.g., microcode) to perform various functions discussed hereinand may optionally be driven by firmware and/or software. Alternatively,each block, unit and/or module may be implemented by dedicated hardware,or as a combination of dedicated hardware to perform some functions anda processor (e.g., one or more programmed microprocessors and associatedcircuitry) to perform other functions. Also, each block, unit and/ormodule of the embodiments may be physically separated into two or moreinteracting and discrete blocks, units and/or modules without departingfrom the scope of the inventive concepts. Further, the blocks, unitsand/or modules of the embodiments may be physically combined into morecomplex blocks, units and/or modules without departing from the scope ofthe inventive concepts.

FIG. 1 is a block diagram illustrating a semiconductor integratedcircuit (IC) card according to exemplary embodiments.

Referring to FIG. 1, a semiconductor IC card 10 may include an externalpackage 100, a subscriber identification module (SIM) circuit 200, aplurality of SIM pins 210-1˜210-n, a storage device 300 and a pluralityof memory pins 310-1˜310-m. Here, n and m are positive integers.

The external package may have an arbitrary size

For example, the external package 100 may have a size and shapeaccording to various semiconductor card standards. In an exemplaryembodiment, the external package 100 may have a size and shape definedby a SIM card standard. In an exemplary embodiment, the external package100 may have a size and shape defined by a micro secure digital (SD)card standard.

The SIM circuit 200 may be formed inside of the external package 100.The SIM circuit 200 may store subscriber information for performingwireless communication.

The SIM pins 210-1˜210-n may be formed on a surface of the externalpackage 100. The SIM pins 210-1˜210-n may comprise conductor pads thatprovide a contact surface for connecting to a communication device towhich it is connected. The SIM pins 210-1˜210-n may be electricallyconnected to the SIM circuit 200 included inside of the external package100 via package wiring of the external package. For example, theexternal package 100 may comprise a package substrate having SIM pins210-1˜210-n on a bottom surface (corresponding to the external surfaceof the external package 100) and one or more redistribution wiringlayers, including wiring layers connecting the SIM pins 210-1˜210-n tothe SIM circuit 200 mounted to an upper surface of the packagesubstrate. The SIM circuit 200 typically comprises a semiconductorintegrated circuit chip or a plurality of interconnected semiconductorintegrated circuit chips.

As will be described with reference to FIGS. 9 and 10, when thesemiconductor IC card 10 is mounted on a communication device, the SIMcircuit 200 may be connected to the communication device via the SIMpins 210-1˜210-n. The SIM circuit 200 may perform a subscriberauthentication using the subscriber information, when the communicationdevice performs wireless communication. For example, the SIM circuit 200may store a unique serial number (an integrated circuit card ID orICCID) to identify itself, an international mobile subscriber identity(IMSI) number, security authentication and ciphering information,temporary information related to the local network, a list of theservices the user has access to, and passwords, such as a personalidentification number (PIN) for ordinary communication device system use(e.g., to allow access and operation of the communication device uponentry and verification of the PIN) and a personal unblocker code (PUK)for PIN unlocking.

The storage device 300 may be formed inside of the external package 100.The storage device 300 may include a nonvolatile memory device which isused as storage medium. For example, the storage device 300 may be aflash memory such as NAND flash or NOR flash or may be a resistive typememory such as a resistive random access memory (RRAM), a phase changerandom access memory (PRAM) or a magnetic random access memory (MRAM).The storage device 300 may store data when a power is cut-off. Thestorage device may comprise one or more semiconductor chips, such as amemory chip or stack of memory chips having memory arrays of the memorydescribed herein. The memory chip or stack of memory chips of the may bemounted to the package substrate of the external package andelectrically connected to memory pins 301-1˜310-m by package wiring,such as via wiring of the package substrate (such as a redistributionlayer of the package substrate).

The storage device 300 may be separate from the SIM circuit 200 insideof the external package 100. For example, one or more firstsemiconductor chips may form the SIM circuit 200 and one or more secondsemiconductor chips, different from the first semiconductor chips, mayform the storage device 300.

The memory pins 301-1˜310-m may be formed on the surface of the externalpackage 100 to provide a contacting surface for connection to thecommunication device. In some examples, all of the memory pins301-1˜310-m are electrically separate from all of the SIM pins210-1˜210-n. In other examples, all of the memory pins 301-1˜310-m areelectrically separate from all of the SIM pins 210-1˜210-n that provideinformation to the SIM circuit 200 and the storage device 300 (e.g.,pins used to transmit commands, data and address information to the SIMcircuit 200 and the storage device 300 are electrically separate fromeach other, but pins used to transmit power may be shared). Pins thatare “electrically separate” are used by and dedicated to only one of SIMcircuit 200 and memory device 300, but not the other. The SIM pins210-1˜210-n and the memory pins 301-1˜310-m may be formed on a samesurface of the external package 100.

As will be described with reference to FIGS. 9 and 10, when thesemiconductor IC card 10 is mounted on a communication device, thestorage device 300 may be connected to the communication device via thememory pins 310-1˜310-n. The storage device 300 may store data providedfrom the communication device that is unrelated to SIM circuit 200operation.

In an exemplary embodiment, the storage device 300 may transmit/receivedata to/from an external device via the memory pins 310-1˜310-n by usinga serial interface of the storage device 300. For example, the storagedevice 300 may correspond to a universal flash storage (UFS) device.Therefore, the storage device 300 may transmit and receive data at ahigh speed. The serial interface of the storage device 300 may compriseone or more data buffers (e.g., each memory chip of storage device 300may comprise a data buffer) that are configured to latch received serialdata and convert the same to parallel data of a certain size forinternal storage.

As described with reference to FIG. 1, the semiconductor IC card 10 mayperform a first function as a storage device to store data and a secondfunction as a SIM card to perform a subscriber authenticationsimultaneously.

FIGS. 2 through 5 are diagrams illustrating examples of thesemiconductor IC card when the semiconductor IC card of FIG. 1 has ashape and size according to a first standard.

As illustrated in FIGS. 2 through 5, an external package 100 a of eachof the semiconductor IC cards 20 a, 20 b, 20 c and 20 d has a shape andsize defined by a nano SIM card standard.

Although it is illustrated in FIGS. 2 through 5 as the external package100 a of each of the semiconductor IC cards 20 a, 20 b, 20 c and 20 dhas a shape and size defined by a nano SIM card standard, the externalpackage 100 a of each of the semiconductor IC cards 20 a, 20 b, 20 c and20 d has a shape and size defined by a micro SIM card standard or miniSIM card standard. The external package 100 a may comprise asemiconductor molding material, such as a resin based molding material,that forms the body of the external package 100 a. The molding materialmay be formed about the package substrate described herein toencapsulate and protect the SIM circuit 200 and storage device 300 whileallowing exposure of the SIM pins 210-1˜210-n and the memory pins301-1˜310-m. The molding material forming the external package 100 a maythus be formed a continuous, homogenous and/or monolithic structure.

Hereinafter, it is assumed that the external package 100 a of each ofthe semiconductor IC cards 20 a, 20 b, 20 c and 20 d has a shape andsize defined by the nano SIM card standard.

In addition, the SIM circuit 200 and the storage device 300 are omittedfrom the semiconductor IC cards 20 a, 20 b, 20 c and 20 d in FIGS. 2through 5 for brevity of explanation.

In addition, it is illustrated that each of the semiconductor IC cards20 a, 20 b, 20 c and 20 d includes a plurality of SIM pins 210-1˜210-5and a plurality of memory pins 310-1˜310-5 in FIGS. 2 through 5. InFIGS. 2 through 5, the external package 100 a may have two pairs ofedges, in which the edges of each pair are arranged opposite to eachother. The edges may include an edge 121 (i.e., an insertion edge) at aninsertion side where each of the semiconductor IC cards 20 a, 20 b, 20 cand 20 d is inserted into a socket, a second edge 123 and a third edge125 that adjoin the edge 121 at the insertion side, and a first edge 127opposite the edge 121 at the insertion side. The insertion edge 121 andthe first edge 127 may therefore provide one of the two pairs of edges,and the second edge 123 and third edge 125 may form the other. The edge121 at the insertion side and the first edge 127 may be substantiallyparallel to each other.

Referring to FIG. 2, the external package 100 a of the semiconductor ICcard 20 a may include a plurality of SIM standard pins C1˜C8 which areformed on a surface of the external package 100 a and are defined by theSIM card standard.

Each of the SIM pins 210-1˜210-5 electrically connected to the SIMcircuit 200 may correspond to one of the SIM standard pins C1˜C8.

In a general SIM card, five SIM standard pins C1, C2, C3, C5 and C7 ofthe SIM standard pins C1˜C8 are used and three SIM standard pins C4, C6and C8 of the SIM standard pins C1˜C8 are not used.

Therefore, the semiconductor IC card 20 a may use the five SIM standardpins C1, C2, C3, C5 and C7 of the SIM standard pins C1˜C8 as the SIMpins 210-1˜210-5 electrically connected to the SIM circuit 200.

In an exemplary embodiment, the memory pins 310-1˜310-5 may be formed ina reserved area RA on the surface of the external package 100 a, inwhich the SIM standard pins C1˜C8 are not formed.

According to the SIM card standard, external pins are not formed in acentral area surrounded by the SIM standard pins C1˜C8. Therefore, thereserved area RA may correspond to the central area surrounded by theSIM standard pins C1˜C8 on the surface.

As mentioned above, the storage device 300 may correspond to a UFSdevice. In general, the UFS device may have fewer external pins foroperation than other kinds of memory cards.

Therefore, the memory pins 310-1˜310-5 for operation of the storagedevice 300 may be formed in the central area surrounded by the SIMstandard pins C1˜C8, on the surface of the external package 100 a.

Referring to FIG. 3, the external package 100 a of the semiconductor ICcard 20 b may include a plurality of SIM standard pins C1˜C8 which areformed on a surface of the external package 100 a and which are definedby the SIM card standard.

Each of the SIM pins 210-1˜210-5 electrically connected to the SIMcircuit 200 may correspond to one of the SIM standard pins C1˜C8.

In a general SIM card, five SIM standard pins C1, C2, C3, C5 and C7 ofthe SIM standard pins C1˜C8 are used and three SIM standard pins C4, C6and C8 of the SIM standard pins C1˜C8 are not used.

Therefore, the semiconductor IC card 20 b may use the five SIM standardpins C1, C2, C3, C5 and C7 of the SIM standard pins C1˜C8 as the SIMpins 210-1˜210-5 electrically connected to the SIM circuit 200.

As mentioned above, the storage device 300 may correspond to a UFSdevice. In general, the UFS device may have fewer external pins foroperation than other kinds of memory cards.

Therefore, the memory pins 310-1˜310-5 for operation of the storagedevice 300 may be formed in the central area surrounded by the SIMstandard pins C1˜C8, on the surface of the external package 100 a.

At least one of the memory pins 310-1˜310-5 may correspond to at leastone of the SIM standard pins C1˜C8.

The semiconductor IC card 20 b may use at least one of SIM standard pinsC4, C6 and C8 of the SIM standard pins C1˜C8, which are not used as thememory pins 310-1˜310-5, as memory pins electrically connected to thestorage device 300.

In FIG. 3, it is illustrated that the three SIM standard pins C4, C6 andC8 of the SIM standard pins C1˜C8 are used as the memory pins 310-3,310-4 and 310-5.

In this case, some memory pins 310-1 and 310-2 of the memory pins310-1˜310-5 may be formed on the surface of the external package 100 aseparately.

In an exemplary embodiment, some memory pins 310-1 and 310-2 of thememory pins 310-1˜310-5 are formed in a reserved area RA on the surfaceof the external package 100 a, in which the SIM standard pins C1˜C8 arenot formed.

According to the SIM card standard, external pins are not formed in acentral area surrounded by the SIM standard pins C1˜C8. Therefore, thereserved area RA may correspond to the central area surrounded by theSIM standard pins C1˜C8 on the surface.

A number of memory pins which are additionally formed on the surface ofthe external package 100 a in the semiconductor IC card 20 b of FIG. 3may be smaller than a number of memory pins which are additionallyformed on the surface of the external package 100 a in the semiconductorIC card 20 a of FIG. 2.

Therefore, the semiconductor IC card 20 b of FIG. 3 may be manufacturedmore simply than the semiconductor IC card 20 a of FIG. 2.

Referring to FIG. 4, the semiconductor IC card 20 c differs from thesemiconductor IC card 20 a of FIG. 2 in that the semiconductor IC card20 c further includes a first card detection pin CD1 and a second carddetection pin CD2 which are formed on the surface of the externalpackage 100 a.

The first card detection pin CD1 may be connected to a ground voltage.In an exemplary embodiment, the second card detection pin CD2 may beconnected to a first voltage higher than the ground voltage. In anotherexemplary embodiment, the second card detection pin CD2 may bemaintained at a floating state.

The semiconductor IC card 20 c may provide different voltages to thefirst card detection pin CD1 and the second card detection pin CD2.

As will be described with reference to FIGS. 9 and 10, when thesemiconductor IC card 20 c is mounted on a communication device, thefirst card detection pin CD1 and the second card detection pin CD2 maybe used to determine whether a card mounted on the communication deviceis the semiconductor IC card 20 c or a normal SIM card.

For example, the communication device determines whether the cardmounted on the communication device is the semiconductor IC card 20 c ora normal SIM card by measuring voltages of the first card detection pinCD1 and the second card detection pin CD2.

Although it is illustrated with reference to FIG. 4 that the first carddetection pin CD1 and the second card detection pin CD2 are formedseparately on the surface of the external package 100 a, some of theunused SIM standard pins C4, C6 and C8, which are not used as the SIMpins 210-1˜210-5 of the SIM standard pins C1˜C8 may be used as the firstcard detection pin CD1 and the second card detection pin CD2 in anexemplary embodiment.

Referring to FIG. 5, the semiconductor IC card 20 d differs from thesemiconductor IC card 20 b of FIG. 3 in that the semiconductor IC card20 d further includes a first card detection pin CD1 and a second carddetection pin CD2 which are formed on the surface of the externalpackage 100 a.

The first card detection pin CD1 may be connected to a ground voltage.In an exemplary embodiment, the second card detection pin CD2 may beconnected to a first voltage higher than the ground voltage. In anotherexemplary embodiment, the second card detection pin CD2 may bemaintained at a floating state.

The semiconductor IC card 20 d may provide different voltages to thefirst card detection pin CD1 and the second card detection pin CD2.

As will be described with reference to FIGS. 9 and 10, when thesemiconductor IC card 20 d is mounted on a communication device, thefirst card detection pin CD1 and the second card detection pin CD2 maybe used to determine whether a card mounted on the communication deviceis the semiconductor IC card 20 d or a normal SIM card.

For example, the communication device determines whether the cardmounted on the communication device is the semiconductor IC card 20 d ora normal SIM card by measuring voltages of the first card detection pinCD1 and the second card detection pin CD2.

FIGS. 6 through 8 are diagrams illustrating examples of thesemiconductor IC card when the semiconductor IC card of FIG. 1 has ashape and size according to a second standard.

As illustrated in FIGS. 6 through 8, an external package 100 b of eachof the semiconductor IC cards 30 a, 30 b and 30 c has a shape and sizedefined by a micro SD card standard.

In addition, the SIM circuit 200 and the storage device 300 are omittedfrom the semiconductor IC cards 30 a, 30 b and 30 c in FIGS. 6 through 8for brevity of explanation.

In addition, it is illustrated that each of the semiconductor IC cards30 a, 30 b and 30 c includes a plurality of SIM pins 210-1˜210-5 and aplurality of memory pins 310-1˜310-5 in FIGS. 6 through 8. In FIGS. 6through 8, the external package 100 b may have two pairs of edges, inwhich the edges of each pair are arranged opposite to each other. Theedges may include an edge 131 (i.e., an insertion edge) at an insertionside where each of the semiconductor IC cards 30 a, 30 b and 30 c isinserted into a socket, a second edge 133 and a third edge 135 thatadjoin the edge 131 at the insertion side, and a first edge 137 oppositethe edge 131 at the insertion side. The insertion edge 131 and the firstedge 137 may therefore provide one of the two pairs of edges, and thesecond edge 133 and third edge 135 may form the other. The edge 131 atthe insertion side and the first edge 137 may be substantially parallelto each other.

Referring to FIG. 6, the external package 100 b of the semiconductor ICcard 30 a may include a plurality of SD standard pins D1˜D8 which areformed on a surface of the external package 100 b and are defined by themicro SD card standard.

Each of the memory pins 310-1˜310-5 electrically connected to thestorage device 300 may correspond to one of the SD standard pins D1˜D8.

As mentioned above, the storage device 300 may correspond to a UFSdevice. In general, the UFS device may have fewer external pins foroperation than other kinds of memory cards.

Therefore, some of the SD standard pins D1˜D8 may be used as the memorypins 310-1˜310-5 for operation of the storage device 300.

In FIG. 6, it is illustrated that five SD standard pins D1, D2, D3, D4and D5 of the SD standard pins D1˜D8 are used as the memory pins310-1˜310-5.

In an exemplary embodiment, the SIM pins 210-1˜210-5 may be formed in areserved area on the surface of the external package 100 b, in which theSD standard pins D1˜D8 are not formed.

As illustrated in FIG. 6, according the micro SD standard, the SDstandard pins D1˜D8 are not formed in a first area AR1 adjacent to theinsertion edge 131 and the insertion edge 131 has a first length L1.External pins are not formed in a second area AR2 adjacent to the firstedge 137 having a second length L2 greater than the first length L1.

The SIM standard pins C1˜C8 defined by the SIM card standard may beformed in the second area AR2, on the surface of the external package100 b. Each of the SIM pins 210-1˜210-5 electrically connected to theSIM circuit 200 may correspond to one of the SIM standard pins C1˜C8.

The semiconductor IC card 30 a may use some of SIM standard pins C1˜C8and as the SIM pins 210-1˜210-5 electrically connected to the SIMcircuit 200.

According to the micro SD standard, the second area AR2 is wider than anarea occupied by the SIM standard pins C1˜C8.

Therefore, the SIM standard pins C1˜C8 may be formed sufficiently in thesecond area AR2 of the external package 100 b.

Referring to FIG. 7, the semiconductor IC card 30 b differs from thesemiconductor IC card 30 a of FIG. 6 in that the semiconductor IC card30 b further includes a first card detection pin CD1 and a second carddetection pin CD2 which are formed in the second area AR2, on thesurface of the external package 100 b.

The first card detection pin CD1 may be connected to a ground voltage.In an exemplary embodiment, the second card detection pin CD2 may beconnected to a first voltage higher than the ground voltage. In anotherexemplary embodiment, the second card detection pin CD2 may bemaintained at a floating state.

The semiconductor IC card 30 b may provide different voltages to thefirst card detection pin CD1 and the second card detection pin CD2.

As will be described with reference to FIGS. 9 and 10, when thesemiconductor IC card 30 b is mounted on a communication device, thefirst card detection pin CD1 and the second card detection pin CD2 maybe used to determine whether a card mounted on the communication deviceis the semiconductor IC card 30 b or a normal SIM card.

For example, the communication device determines whether the cardmounted on the communication device is the semiconductor IC card 30 b ora normal SIM card by measuring voltages of the first card detection pinCD1 and the second card detection pin CD2.

Although it is illustrated with reference to FIG. 7 that the first carddetection pin CD1 and the second card detection pin CD2 are formedseparately in the second area AR2 of the external package 100 b, thesemiconductor IC card 30 c of FIG. 8 uses some of unused SD standardpins D6, D7 and D8 of the SD standard pins D1˜D8, which are not used asthe memory pins 310-1˜310-5, as the first card detection pin CD1 and thesecond card detection pin CD2 without forming the first card detectionpin CD1 and the second card detection pin CD2 separately in the secondarea AR2 of the external package 100 b.

The semiconductor IC card 30 c of FIG. 8 differs from the semiconductorIC card 30 b of FIG. 7 in that the semiconductor IC card 30 c of FIG. 8uses some of unused SD standard pins D6, D7 and D8 of the SD standardpins D1˜D8, which are not used as the memory pins 310-1˜310-5, as thefirst card detection pin CD1 and the second card detection pin CD2.Therefore, detailed description of the semiconductor IC card 30 c ofFIG. 8 will be omitted for the sake of brevity.

FIG. 9 is a block diagram illustrating a communication system accordingto exemplary embodiments.

Referring to FIG. 9, a communication system 1000 a may include acommunication device 1100 and a semiconductor IC card 1200 a.

In an exemplary embodiment, the communication system 1000 a may furtherinclude a SIM card 1300.

The communication device 1100 may be an arbitrary communication devicecapable of performing wireless communication. For example, thecommunication device 1100 may be a smart phone, a tablet personalcomputer (PC), etc.

As illustrated in FIG. 9, the communication device 1100 may include afirst external card slot SL1 and a second external card slot SL2 onwhich an external semiconductor card is mounted.

The first external card slot SL1 may accommodate selectively one of acard having a shape and a size defined by the SIM card standard and acard having a shape and a size defined by the micro SD card standard.

The second external card slot SL2 may accommodate a card having a shapeand a size defined by the SIM card standard.

The semiconductor IC card 1200 a may be mounted on (or may be insertedinto) the first external card slot SL1. “Mounted on” as used hereinrefers to a removable connection (e.g., of the semiconductor IC card1200 a) to the communication device to allow a user of the communicationdevice to attach and detach the semiconductor IC card 1200 a in a securemanner. The removable connection may be comprise inserting thesemiconductor IC card 1200 a into a slot (which may hold thesemiconductor IC card 1200 a in place with a compressing force betweenthe major surfaces of the semiconductor IC card 1200 a and/or have amechanical latch to prevent the card from being withdrawn until thelatch is released). The removable connection may comprise removing acover of the communication device, inserting the semiconductor IC card1200 a into a slot, and reattaching the cover of the communicationdevice. It will be apparent that other types of removable connectionsmay be implemented to mount the semiconductor IC card 1200 a on thecommunication device.

As illustrated in FIG. 9, the semiconductor IC card 1200 a may have ashape and a size defined by the SIM card standard.

The semiconductor IC card 1200 a may employ one of the semiconductor ICcards 20 a, 20 b, 20 c and 20 d illustrated in FIGS. 2 through 5.

Therefore, when the semiconductor IC card 1200 a is mounted on the firstexternal card slot SL1 of the communication device 1100, the SIM circuit200 in the semiconductor IC card 1200 a is electrically connected to thecommunication device 1100 via the SIM pins 210-1˜210-n and the storagedevice 300 in the semiconductor IC card 1200 a is electrically connectedto the communication device 1100 via the memory pins 310-1˜310-m.

Therefore, the semiconductor IC card 1200 a may simultaneously perform afirst function to store data provided from the communication device 1100and a second function to perform a subscriber authentication using firstsubscriber information when the communication device 1100 performswireless communication through a first wireless network.

Since configuration and operation of each of the semiconductor IC cards20 a, 20 b, 20 c and 20 d have been previously described with referenceto FIGS. 2 through 5, a detailed description of the semiconductor ICcard 1200 a will not be repeated here for the sake of brevity.

The SIM card 1300 may be mounted on (or may be inserted into) the secondexternal card slot SL2.

The SIM card 1300 may be a general SIM card having a shape and a sizedefined by a SIM card standard.

Therefore, the SIM card 1300 may perform a subscriber authenticationusing second subscriber information when the communication device 1100performs wireless communication through a second wireless network.

FIG. 10 is a block diagram illustrating a communication system accordingto exemplary embodiments.

Referring to FIG. 10, a communication system 1000 b may include acommunication device 1100 and a semiconductor IC card 1200 b.

In an exemplary embodiment, the communication system 1000 b may furtherinclude a SIM card 1300.

As illustrated in FIG. 10, the communication device 1100 may include afirst external card slot SL1 and a second external card slot SL2 onwhich an external semiconductor card is mounted.

The first external card slot SL1 may selectively accommodate one of acard having a shape and a size defined by the SIM card standard and acard having a shape and a size defined by the micro SD card standard.

The second external card slot SL2 may accommodate a card having a shapeand a size defined by the SIM card standard.

The semiconductor IC card 1200 b may be mounted on (or may be insertedinto) the first external card slot SL1.

As illustrated in FIG. 10, the semiconductor IC card 1200 b may have ashape and a size defined by the micro SD card standard.

The semiconductor IC card 1200 b may employ one of the semiconductor ICcards 30 a, 30 b and 30 c illustrated in FIGS. 6 through 8.

Therefore, the semiconductor IC card 1200 b may simultaneously perform afirst function to store data provided from the communication device 1100and a second function to perform subscriber authentication using firstsubscriber information when the communication device 1100 performswireless communication through a first wireless network.

Since configuration and operation of each of the semiconductor IC cards30 a, 30 b and 30 c have been previously described with reference toFIGS. 6 through 8, a detailed description of the semiconductor IC card1200 b will not be repeated here for the sake of brevity.

The semiconductor IC card 1200 b in the communication system 1000 b ofFIG. 10 differs from the semiconductor IC card 1200 a in thecommunication system 1000 a of FIG. 9 in that while the semiconductor ICcard 1200 a in the communication system 1000 a of FIG. 9 has a shape anda size defined by the SIM card standard, the semiconductor IC card 1200b in the communication system 1000 b of FIG. 10 has a shape and a sizedefined by the micro SD card standard.

In general, when a communication device is to perform wirelesscommunication through two different wireless networks, two SIM cardscorresponding to the two wireless networks should be mounted on thecommunication device.

Conventionally, the communication device 1100 in the communicationsystem 1000 a or 1000 b in FIGS. 9 and 10, includes the first externalcard slot SL1 and the second external card slot SL2 on which an externalsemiconductor card is to be mounted, the communication device 1100cannot use an additional external memory card because the communicationdevice 1100 lacks a third slot to which the external memory card may bemounted (because the first and second external card slots SL1 and SL2are occupied by two conventional SIM cards).

However, as described with reference to FIGS. 9 and 10, thesemiconductor IC card 1200 a or 1200 b which is mounted on the firstexternal card slot SL1 of the communication device 1100 may compriseboth a SIM circuit 200 and a storage device 300 to thus simultaneouslyperform a first function to store data provided from the communicationdevice 1100 as a storage device and a second function to performsubscriber authentication as a SIM card when the communication device1100 performs wireless communication.

Therefore, the communication system 1000 a or 1000 b including thesemiconductor IC card 1200 a or 1200 b may use the semiconductor IC card1200 a or 1200 b as an external memory card while performing wirelesscommunication through two different wireless networks, although thecommunication system 1000 a or 1000 b includes two external card slotsSL1 and SL2.

The storage device 300 in the semiconductor IC card 1200 a or 1200 b maycorrespond to a UFS device. The UFS device transmits/receives data usinga serial interface, and the UFS device may operate normally when adistance between the UFS device and a UFS host is long.

Therefore, when the semiconductor IC card 1200 a or 1200 b is mounted onthe first external card slot SL1 of the communication system 1000 a or1000 b, the storage device 300 may operate normally even though adistance between the storage device 300 and an application processor islong.

FIGS. 11 and 12 are diagrams for explaining that the communicationdevice in the communication system of FIGS. 9 and 10 detects whether asemiconductor IC card is mounted.

As described with reference to FIGS. 4, 5, 7 and 8, a semiconductor ICcard 1200 corresponding to one of the semiconductor IC cards 1200 a and1200 b, includes the first card detection pin CD1 and the second carddetection pin CD2.

As illustrated in FIGS. 11 and 12, the first card detection pin CD1 maybe electrically connected to a ground voltage GND.

In an exemplary embodiment, the second card detection pin CD2 may beelectrically connected to a first voltage VCC higher than the groundvoltage GND as illustrated in FIG. 11.

In another exemplary embodiment, the second card detection pin CD2 maybe maintained at a floating state as illustrated in FIG. 12.

As illustrated in FIGS. 11 and 12, the communication device 1100 mayinclude a first pull-up resistor R1 and a second pull-up resistor R2.

The first pull-up resistor R1 may be connected between a power supplyvoltage VDD and a first node N1 electrically connected to the first carddetection pin CD1 of the semiconductor IC card 1200 when thesemiconductor IC card 1200 is mounted on the first external card slotSL1.

The second pull-up resistor R2 may be connected between the power supplyvoltage VDD and a second node N2 electrically connected to the secondcard detection pin CD2 of the semiconductor IC card 1200 when thesemiconductor IC card 1200 is mounted on the first external card slotSL1.

As illustrated in FIG. 11, when the second card detection pin CD2 iselectrically connected to the first voltage VCC higher than the groundvoltage GND, the communication device 1100 determines that thesemiconductor IC card 1200 is mounted on the first external card slotSL1 when a voltage of the first node N1 corresponds to the groundvoltage GND and a voltage of the second node N2 corresponds to the firstvoltage VCC.

As illustrated in FIG. 12, when the second card detection pin CD2 ismaintained at a floating state, the communication device 1100 determinesthat the semiconductor IC card 1200 is mounted on the first externalcard slot SL1 when a voltage of the first node N1 corresponds to theground voltage GND and a voltage of the second node N2 corresponds tothe power supply voltage VDD.

FIG. 13 is a flow chart illustrating an initial operation when thecommunication system of FIGS. 9 and 10 is turned-on.

When the communication device 1100 is turned-on (S110), thecommunication device 1100 determines whether the semiconductor IC card1200 or a general SIM card is mounted on the first external card slotSL1 (S120).

The communication device 1100 determines whether the semiconductor ICcard 1200 is mounted on the first external card slot SL1 based on amethod described with reference to FIGS. 9 and 10.

When the communication device 1100 determines that the semiconductor ICcard 1200 is mounted on the first external card slot SL1 (YES in S120),the communication device 1100 provides a power supply voltage to thestorage device 300 in the semiconductor IC card 1200 via the memory pins310-1˜310-5 (S130).

Therefore, the storage device 300 is turned-on, and the communicationdevice 1100 performs a start-up operation on the storage device 300(S140). The communication device 1100 may use the storage device 300 asstorage media.

Afterwards, the communication device 1100 performs a normal operation(S150).

When the communication device 1100 repeatedly determines whether thesemiconductor IC card 1200 is mounted on the first external card slotSL1 during a given time interval, and the communication device 1100determines that the general SIM card instead of the semiconductor ICcard 1200 is mounted on the first external card slot SL1 during thegiven time interval, the communication device 1100 immediately performsthe normal operation (S150) without providing a power supply voltage foroperation of the storage device 300 to the storage device 300.

Therefore, when the communication system 1000 a or 1000 b in FIG. 9 orFIG. 10 determines that the semiconductor IC card 1200 is mounted on thefirst external card slot SL1, the communication system 1000 a or 1000 bperforms a normal operation by using the semiconductor IC card 1200 as astorage media in addition to using the semiconductor IC card 1200 as aSIM card.

On the contrary, when the communication system 1000 a or 1000 b in FIG.9 or FIG. 10 determines that the general SIM card is mounted on thefirst external card slot SL1, the communication system 1000 a or 1000 bperforms a normal operation by using the card mounted on the firstexternal card slot SL1 as a SIM card.

The present disclosure may be applied to various communication devices.For example, the present disclosure may be applied to a mobile phone, asmart phone, a personal digital assistant (PDA), a tablet PC, etc.

The foregoing is illustrative of exemplary embodiments and is not to beconstrued as limiting thereof. Although a few exemplary embodiments havebeen described, those skilled in the art will readily appreciate thatmany modifications are possible in the exemplary embodiments withoutmaterially departing from the novel teachings and advantages of thepresent disclosure. Accordingly, all such modifications are intended tobe included within the scope of the present disclosure as defined in theclaims. Therefore, it is to be understood that the foregoing isillustrative of various exemplary embodiments and is not to be construedas limited to the specific exemplary embodiments disclosed, and thatmodifications to the disclosed exemplary embodiments, as well as otherexemplary embodiments, are intended to be included within the scope ofthe appended claims.

What is claimed is:
 1. A semiconductor integrated circuit (IC) cardcomprising: an external package having two pairs of edges, in which theedges of each pair are arranged opposite to each other, a first pair ofedges of the two pairs of edges extending in a first direction and asecond pair of edges of the two pairs of edges extending in a seconddirection perpendicular to the first direction; a subscriberidentification module (SIM) circuit formed inside of the externalpackage, the SIM circuit configured to store subscriber information; aplurality of SIM pins which are formed on a surface of the externalpackage and are electrically connected to the SIM circuit; a storagedevice which is formed inside of the external package and is separatedfrom the SIM circuit, the storage device including a universal flashstorage (UFS) device configured to transmit/receive data to/from anexternal device by using a serial interface of the storage device; and aplurality of memory pins which are formed on the surface of the externalpackage and are electrically connected to the storage device, whereinthe serial interface includes one or more data buffers configured tolatch serial data to convert the latched serial data to parallel data,wherein the serial interface is included in the storage device, whereinat least a first SIM pin of the plurality of SIM pins is formed adjacentto a first edge of the first pair of edges, wherein at least a secondSIM pin of the plurality of SIM pins is formed adjacent to a second edgeof the first pair of edges, wherein at least a third SIM pin of theplurality of SIM pins is formed adjacent to a first edge of the secondpair of edges, and wherein at least a fourth SIM pin of the plurality ofSIM pins is formed adjacent to a second edge of the second pair ofedges.
 2. The semiconductor IC card of claim 1, wherein the externalpackage has a shape and a size defined by a SIM card standard, and theplurality of SIM pins which are formed on the surface are defined by theSIM card standard.
 3. The semiconductor IC card of claim 2, wherein eachof the plurality of SIM pins corresponds to a SIM standard pin.
 4. Thesemiconductor IC card of claim 2, wherein the memory pins are formed ina central region on the surface of the external package and the centralregion is surrounded by the plurality of SIM pins.
 5. The semiconductorIC card of claim 2, wherein a first set of pins of the plurality of SIMpins is electrically connected to the SIM circuit, wherein a second setof pins of the plurality of SIM pins is not electrically connected tothe SIM circuit, and wherein one or more pins of the second set of pinsof the plurality of SIM pins are configured for use as one or morerespective memory pins and are electrically connected to the storagedevice.
 6. The semiconductor IC card of claim 1, wherein the UFS deviceis one of a NAND flash and a NOR flash.
 7. The semiconductor IC card ofclaim 1, further comprising: a first card detection pin which is formedon the surface and is electrically connected to a ground voltage; and asecond card detection pin which is formed on the surface and iselectrically connected to a first voltage higher than the groundvoltage.
 8. The semiconductor IC card of claim 1, further comprising: afirst card detection pin which is formed on the surface and iselectrically connected to a ground voltage; and a second card detectionpin which is formed on the surface and is maintained with a floatingstate.
 9. A semiconductor integrated circuit (IC) card comprising: anexternal package having two pairs of edges, in which the edges of eachpair are arranged opposite to each other, a first pair of edges of thetwo pairs of edges extending in a first direction and a second pair ofedges of the two pairs of edges extending in a second directionperpendicular to the first direction; a subscriber identification module(SIM) circuit formed inside of the external package, the SIM circuitconfigured to store subscriber information; a plurality of SIM pinswhich are formed on a surface of the external package and a first set ofpins of the plurality of SIM pins is electrically connected to the SIMcircuit; a storage device which is formed inside of the external packageand is separated from the SIM circuit, the storage device including anonvolatile memory device; and a plurality of memory pins which areformed on the surface of the external package and electrically connectedto the storage device, wherein: the external package has a shape and asize defined by a SIM card standard, a second set of pins of theplurality of SIM pins is not electrically connected to the SIM circuit,one or more pins of the second set of pins of the plurality of SIM pinsare configured for use as one or more respective memory pins and areelectrically connected to the storage device, the storage device isconfigured to transmit/receive data to/from an external device throughthe memory pins by using a serial interface, the serial interfaceincludes one or more data buffers configured to latch serial data toconvert the latched serial data to parallel data, the serial interfaceis included in the storage device, wherein at least a first SIM pin ofthe plurality of SIM pins is formed adjacent to a first edge of thefirst pair of edges, wherein at least a second SIM pin of the pluralityof SIM pins is formed adjacent to a second edge of the first pair ofedges, wherein at least a third SIM pin of the plurality of SIM pins isformed adjacent to a first edge of the second pair of edges, and whereinat least a fourth SIM pin of the plurality of SIM pins is formedadjacent to a second edge of the second pair of edges.
 10. Thesemiconductor IC card of claim 9, wherein the memory pins are formed ina central region on the surface which is surrounded by the plurality ofSIM pins on the surface of the external package.
 11. The semiconductorIC card of claim 9, wherein the external package has a shape and a sizedefined by a nano SIM card standard.
 12. The semiconductor IC card ofclaim 9, further comprising: a first card detection pin which is formedon the surface and is electrically connected to a ground voltage; and asecond card detection pin which is formed on the surface and iselectrically connected to a first voltage higher than the groundvoltage.
 13. A communication system comprising: a communication deviceincluding a first external card slot and a second external card slot;and a semiconductor integrated circuit (IC) card mounted on the firstexternal card slot, the semiconductor IC card configured to perform afirst function to store data provided from the communication device anda second function to perform a subscriber authentication using a firstsubscriber information when the communication device performs a wirelesscommunication via a first wireless network, wherein the semiconductor ICcard comprises: an external package having two pairs of edges, in whichthe edges of each pair are arranged opposite to each other, a first pairof edges of the two pairs of edges extending in a first direction and asecond pair of edges of the two pairs of edges extending in a seconddirection perpendicular to the first direction; a first subscriberidentification module (SIM) circuit formed inside of the externalpackage, the first SIM circuit configured to store the first subscriberinformation; a plurality of SIM pins which are formed on a surface ofthe external package and electrically connected to the first SIMcircuit; a storage device which is formed inside of the external packageand is separated from the SIM circuit, the storage device including anonvolatile memory device; and a plurality of memory pins which areformed on the surface of the external package and are electricallyconnected to the storage device, wherein the nonvolatile memory deviceis a universal flash storage (UFS) device that transmits/receives datato/from an external device by using a serial interface of the storagedevice, wherein the serial interface includes one or more data buffersconfigured to latch serial data to convert the latched serial data toparallel data, wherein the serial interface is included in the storagedevice, wherein at least a first SIM pin of the plurality of SIM pins isformed adjacent to a first edge of the first pair of edges, wherein atleast a second SIM pin of the plurality of SIM pins is formed adjacentto a second edge of the first pair of edges, wherein at least a thirdSIM pin of the plurality of SIM pins is formed adjacent to a first edgeof the second pair of edges, and wherein at least a fourth SIM pin ofthe plurality of SIM pins is formed adjacent to a second edge of thesecond pair of edges.
 14. The communication system of claim 13, furthercomprising: a first card detection pin which is formed on the surface ofthe external package and is electrically connected to a ground voltage;and a second card detection pin which is formed on the surface of theexternal package and is electrically connected to a first voltage higherthan the ground voltage.
 15. The communication system of claim 13,wherein the communication device further includes a second external cardslot, and wherein the semiconductor IC card further includes: a secondSIM circuit mounted on the second external card slot and configured tostore second subscriber information and to perform subscriberauthentication using a second subscriber information when thecommunication device performs a wireless communication via a secondwireless network.
 16. The communication system of claim 15, wherein: theexternal package has a shape and a size defined by a SIM card standard,the plurality of SIM pins which are formed on the surface are defined bythe SIM card standard, and the second SIM circuit has a shape and a sizedefined by the SIM card standard.
 17. The communication system of claim15, wherein: the external package has a shape and a size defined by amicro secure digital (SD) card standard, the plurality of SIM pins whichare formed on the surface are defined by a SIM card standard, and thesecond SIM circuit has a shape and a size defined by the SIM cardstandard.